Advanced Micro Devices

3D IC and ADVANCED PACKAGING CAD ENGINEER

📍 Location
markham, on
⏰ Job Type
Full-time
📅 Posted
June 16, 2026
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Job Description

WHAT YOU DO AT AMD CHANGES EVERYTHING

THE ROLE

The 3D-IC Design and SoC Construction CAD team delivers automated environments for industry-leading 3D stack generation and validation. Our flows encompass design element creation, port assignment and pattern generation, tile optimization, clock and power distribution, high-performance bus implementation, and timing budgeting. We evaluate, procure, and deploy technologies from leading EDA vendors within a unified flow framework – and increasingly, we embed AI-driven capabilities at every stage of the stack, from silicon to system.

This role is part of a global team working in concert with design teams across North America, China, and India. You will collaborate directly with the global CAD organization and project teams to understand design requirements and deliver innovative solutions that combine EDA tools, custom in-house capabilities, and end-to-end AI integration. The ideal candidate brings a strong s...

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