Job Description
To help grow our organization we are looking for an Advanced Packaging Lead to collaborate with a bright group of engineers to tackle complex and interesting problems at the intersection of AI and hardware.
Responsibilities
- Develop advanced packaging solutions for next generation AI products
- Collaborate with internal stakeholders, product, architecture and design to analyze and propose packaging solutions to improve performance, reliability and manufacturability
- Drive technical decisions, short-term and long-term, on packaging solutions, chiplet strategy and die-to-die interfaces
- Manage and collaborate with external suppliers, foundry and OSAT to propose leading-edge packaging solutions
- Review electrical, thermal, mechanical and feasibility data from suppliers and lead analysis through high volume production
- Resolve quality and integrity issues related to package design
- Drive long term plans to grow internal...