Ciena Corporation

Photonic Process Engineer: Wire Bonding & Die Attach

📍 Location
ottawa, on
⏰ Job Type
Full-time
📅 Posted
June 04, 2026
Apply Now

Job Description

A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.
#J-18808-Ljbffr

Start Your Week Right!

Apply now and make every Monday exciting with Ciena Corporation

Apply for this Position