Job Description
Company Background
A leading semiconductor materials provider specializing in high-quality packaging materials, including solder spheres and solder paste, supporting advanced chip packaging and global semiconductor assembly operations.
Job Responsibilities:
- Analyse process performance and identify opportunities for continuous improvement.
- Support new product introduction (NPI), process qualification and validation activities.
- Develop, review and update process parameters, work instructions and standard operating procedures (SOPs).
- Conduct root cause analysis and implement corrective and preventive actions (CAPA) for process-related issues.
- Collaborate with Production, QA and EHS teams to resolve process abnormalities and improve manufacturing performance.
- Equipment Engineering- Manage production equipment installation, commissioning and qualification.
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